# git rev-parse -q --verify d01e12dd3f4227f1be5d7c5bffa7b8240787bec1^{commit}
d01e12dd3f4227f1be5d7c5bffa7b8240787bec1
already have revision, skipping fetch
# git checkout -q -f -B kisskb d01e12dd3f4227f1be5d7c5bffa7b8240787bec1
# git clean -qxdf
# < git log -1
# commit d01e12dd3f4227f1be5d7c5bffa7b8240787bec1
# Merge: 9502f0d 84b64de
# Author: Linus Torvalds <torvalds@linux-foundation.org>
# Date:   Thu Aug 16 10:21:18 2018 -0700
# 
#     Merge branch 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal
#     
#     Pull thermal management updates from Eduardo Valentin:
#     
#      - rework tsens driver to add support for tsens-v2 (Amit Kucheria)
#     
#      - rework armada thermal driver to use syscon and multichannel support
#        (Miquel Raynal)
#     
#      - fixes to TI SoC, IMX, Exynos, RCar, and hwmon drivers
#     
#     * 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (34 commits)
#       thermal: armada: fix copy-paste error in armada_thermal_probe()
#       thermal: rcar_thermal: avoid NULL dereference in absence of IRQ resources
#       thermal: samsung: Remove Exynos5440 clock handling left-overs
#       thermal: tsens: Fix negative temperature reporting
#       thermal: tsens: switch from of_iomap() to devm_ioremap_resource()
#       thermal: tsens: Rename variable
#       thermal: tsens: Add generic support for TSENS v2 IP
#       thermal: tsens: Rename tsens-8996 to tsens-v2 for reuse
#       thermal: tsens: Add support to split up register address space into two
#       dt: thermal: tsens: Document the fallback DT property for v2 of TSENS IP
#       thermal: tsens: Get rid of unused fields in structure
#       thermal_hwmon: Pass the originating device down to hwmon_device_register_with_info
#       thermal_hwmon: Sanitize attribute name passed to hwmon
#       dt-bindings: thermal: armada: add reference to new bindings
#       dt-bindings: cp110: add the thermal node in the syscon file
#       dt-bindings: cp110: update documentation since DT de-duplication
#       dt-bindings: ap806: add the thermal node in the syscon file
#       dt-bindings: cp110: prepare the syscon file to list other syscons nodes
#       dt-bindings: ap806: prepare the syscon file to list other syscons nodes
#       dt-bindings: cp110: rename cp110 syscon file
#       ...
# < /opt/cross/kisskb/gcc-5.3.0-nolibc/powerpc64-linux/bin/powerpc64-linux-gcc --version
# < git log --format=%s --max-count=1 d01e12dd3f4227f1be5d7c5bffa7b8240787bec1
# < make -s -j 120 ARCH=powerpc O=/kisskb/build/linus_44x_fsp2_defconfig_powerpc-5.3 CROSS_COMPILE=/opt/cross/kisskb/gcc-5.3.0-nolibc/powerpc64-linux/bin/powerpc64-linux-  44x/fsp2_defconfig
# make -s -j 120 ARCH=powerpc O=/kisskb/build/linus_44x_fsp2_defconfig_powerpc-5.3 CROSS_COMPILE=/opt/cross/kisskb/gcc-5.3.0-nolibc/powerpc64-linux/bin/powerpc64-linux-  
INFO: Uncompressed kernel (size 0x8acc88) overlaps the address of the wrapper(0x400000)
INFO: Fixing the link_address of wrapper to (0x900000)
Image Name:   Linux-4.18.0-gd01e12d
Created:      Fri Aug 17 04:36:58 2018
Image Type:   PowerPC Linux Kernel Image (gzip compressed)
Data Size:    3923760 Bytes = 3831.80 kB = 3.74 MB
Load Address: 00000000
Entry Point:  00000000
Completed OK
# rm -rf /kisskb/build/linus_44x_fsp2_defconfig_powerpc-5.3
# Build took: 0:00:31.771287