Buildresult: linus/44x/fsp2_defconfig/powerpc-gcc5 built on Aug 17 2018, 04:36

kisskb

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Status:	OK
Date/Time:	Aug 17 2018, 04:36
Duration:	0:00:31.771287
Builder:	ka4
Revision:	Merge branch 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal (`d01e12dd3f4227f1be5d7c5bffa7b8240787bec1)`
Target:	linus/44x/fsp2_defconfig/powerpc-gcc5
Branch:	linus
Compiler:	powerpc-gcc5 (powerpc64-linux-gcc (GCC) 5.3.0)
Config:	44x/fsp2_defconfig (download)
Log:	Download original No warnings found in log. Full Log # git rev-parse -q --verify d01e12dd3f4227f1be5d7c5bffa7b8240787bec1^{commit} d01e12dd3f4227f1be5d7c5bffa7b8240787bec1 already have revision, skipping fetch # git checkout -q -f -B kisskb d01e12dd3f4227f1be5d7c5bffa7b8240787bec1 # git clean -qxdf # < git log -1 # commit d01e12dd3f4227f1be5d7c5bffa7b8240787bec1 # Merge: 9502f0d 84b64de # Author: Linus Torvalds <torvalds@linux-foundation.org> # Date: Thu Aug 16 10:21:18 2018 -0700 # # Merge branch 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal # # Pull thermal management updates from Eduardo Valentin: # # - rework tsens driver to add support for tsens-v2 (Amit Kucheria) # # - rework armada thermal driver to use syscon and multichannel support # (Miquel Raynal) # # - fixes to TI SoC, IMX, Exynos, RCar, and hwmon drivers # # * 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (34 commits) # thermal: armada: fix copy-paste error in armada_thermal_probe() # thermal: rcar_thermal: avoid NULL dereference in absence of IRQ resources # thermal: samsung: Remove Exynos5440 clock handling left-overs # thermal: tsens: Fix negative temperature reporting # thermal: tsens: switch from of_iomap() to devm_ioremap_resource() # thermal: tsens: Rename variable # thermal: tsens: Add generic support for TSENS v2 IP # thermal: tsens: Rename tsens-8996 to tsens-v2 for reuse # thermal: tsens: Add support to split up register address space into two # dt: thermal: tsens: Document the fallback DT property for v2 of TSENS IP # thermal: tsens: Get rid of unused fields in structure # thermal_hwmon: Pass the originating device down to hwmon_device_register_with_info # thermal_hwmon: Sanitize attribute name passed to hwmon # dt-bindings: thermal: armada: add reference to new bindings # dt-bindings: cp110: add the thermal node in the syscon file # dt-bindings: cp110: update documentation since DT de-duplication # dt-bindings: ap806: add the thermal node in the syscon file # dt-bindings: cp110: prepare the syscon file to list other syscons nodes # dt-bindings: ap806: prepare the syscon file to list other syscons nodes # dt-bindings: cp110: rename cp110 syscon file # ... # < /opt/cross/kisskb/gcc-5.3.0-nolibc/powerpc64-linux/bin/powerpc64-linux-gcc --version # < git log --format=%s --max-count=1 d01e12dd3f4227f1be5d7c5bffa7b8240787bec1 # < make -s -j 120 ARCH=powerpc O=/kisskb/build/linus_44x_fsp2_defconfig_powerpc-5.3 CROSS_COMPILE=/opt/cross/kisskb/gcc-5.3.0-nolibc/powerpc64-linux/bin/powerpc64-linux- 44x/fsp2_defconfig # make -s -j 120 ARCH=powerpc O=/kisskb/build/linus_44x_fsp2_defconfig_powerpc-5.3 CROSS_COMPILE=/opt/cross/kisskb/gcc-5.3.0-nolibc/powerpc64-linux/bin/powerpc64-linux- INFO: Uncompressed kernel (size 0x8acc88) overlaps the address of the wrapper(0x400000) INFO: Fixing the link_address of wrapper to (0x900000) Image Name: Linux-4.18.0-gd01e12d Created: Fri Aug 17 04:36:58 2018 Image Type: PowerPC Linux Kernel Image (gzip compressed) Data Size: 3923760 Bytes = 3831.80 kB = 3.74 MB Load Address: 00000000 Entry Point: 00000000 Completed OK # rm -rf /kisskb/build/linus_44x_fsp2_defconfig_powerpc-5.3 # Build took: 0:00:31.771287

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